Packaging Engineer

The Packaging Engineer will be responsible for designing and implementing next generation MEMS packaging technology for reliable, low cost solutions that have a high degree of manufacturability within a large volume process.  This position will also assist in the sustaining engineering function for current packaging technology.

This qualified candidate will partner with cross functional engineering teams and a diverse supply base to develop processes and materials for packaging of leading edge acoustic MEMS devices. 

Good package design, fundamental materials knowledge, and failure analysis capabilities a must.  Good supplier management and sustaining engineering skills a plus.

Reporting Structure:         Direct to Package Development Manager

Responsibilities include:

• Working with a team to translate next generation product needs into manufacturable low cost designs
• Working with vendors and other team members to identify and support high yielding processes for current package technology
• Owning development for cost reduction and performance improvement
• Keeping current with existing and emerging  patent and industry literature
• Working with a high volume manufacturing team to perform successful technology transfer and to support new designs

Relevant Skills:

• Experience in package design and development including a strong understanding of  the relationship between materials and package performance (experience in MEMS packaging a plus)
• Experience in the design and manufacture of multi-layer organic substrate and circuit boards.  Familiarity and operational ability on industry standard design platforms (P-CAD, AutoCAD, Synopsys, SolidWorks) a plus
• Familiarity with current high volume IC/MEMS assembly processes (die attach, flip chip, wafer saw, wire bond, direct chip attach, surface mount, package singulation, etc.)
• Proven track record of development and selection of materials for assembly and for improved performance of IC/MEMS devices
• Experience in failure analysis methodology required

Qualifications:

• BS in Materials Science or Mechanical Engineering; higher degrees preferred
• 5-7 years relevant experience in package design and development; MEMS  packaging experience a plus
• Proven track record of package design and development leadership (from concept to implementation)
• Ability to work in a team environment under tight deadlines and high pressure situations consistent with a start-up environment an absolute must

Compensation:

The company will create a compelling compensation package to attract a high caliber candidate.  The position should be viewed as an opportunity to be an early member of the core team building a world-class company.

To apply for this position, please send us an email with a cover letter, salary requirements, references and resume to [email protected]

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